Jsputter8000 Magnetron Sputtering System
型 号（Model）: Jsputter 8000
生产商（Manufacturer): ULVAC Technologies, Inc., Japan
用 途（Application）:
纳米级的单层及多层功能膜-各种硬质膜、介质膜、铁磁膜和磁性薄膜等的研发。 Intended for the R&D of new materials, MRAM, magnetic sensor devices, pilot production of discrete devices for electrode, and ferro magnetic film.
主要参数（Main Parameters):
本底真空(Ultimate Pressure): < 2.66×10-6Pa
沉积室尺寸(Deposition Chamber) : W450×D410×H450m
基片尺寸(Substrate Size): F2~8 inch
基片旋转速度(Rotating Speed)：0~20 rpm(Motor driven)
沉积功率(Cathode Power): DC power supply 500W×3sets
RF power supply 200W×2sets
基片温度（Substrate Heating): Max.800±20
厚度均匀性(Thickness Uniformity): <±3%(F80mm)
沉积速率(Deposition Rate): >3.0 nm/min(Ni films) ，>2.0 nm/min(ZnO films)
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